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This position is Intel 3D NAND wafer level Test Product Development Engineer for a high volume manufacturing fab located in Dalian China.
Qualified candidate is responsible for developing and maintaining wafer level functional test strategies and programs developing innovative solutions for production test flows interface hardware and test equipment.
Your responsibilities also include performing redundancy analysis schemes optimizing device yields and partnering with stakeholders to optimize and automate equipment and processes.
As Test Product Development Engineer you'll initiate and lead cross functional teams develop and drive to meet project deadlines and solve difficult technical problems with creative thinking.
This position is associated with the sale of Intel’s NAND memory and storagebusiness to SK Hynix (You can read more about the transaction in the press release - ). The transaction will enhance the resources and potential of the business’ storage solutions, including client and enterprise SSDs, in the rapidly growing NAND Flash space amid the era of big data.
This is an exciting time to be at Intel – come join our NAND-DTM and work on the most advanced 3DNAND and SSD technology in the world. As the global leader in the semiconductor industry, Intel possesses industry-leading SSD technology and the most capable Quadruple Level Cell (QLC) NAND Flash products, and you will be part of a world-class team that will transition to lead the SSD business at SK Hynix.
This position aligns to Phase 2 of the transaction, which includes NAND technology and component development along with fab operations. Employees aligned to Phase 2 will continue to be employed by Intel and will continue to develop NAND technology and components and manufacture NAND wafers at the fab. Phase 2 of the transaction is expected to close in March 2025, at which time employees aligned to this phase of the transaction will transition employment to SK Hynix.
Minimum Qualifications Bachelor MS degree in Electronic Engineering or Computer Engineering
Advanced CC programming and Linux skills
Proficiency in APG programming
Fluent in both English and Mandarin
2 years work experience in related field
Demonstrate experience in project management and problem solving
Demonstrate experience in semiconductor manufacturing and semiconductor testing or relevant experience in NAND product functional test program development is a plus
Advanced understanding of NAND test equipment and interface hardware
Advanced Perl programming skills Intermediate Python programming skills
Intermediate understanding of statistical principle and data analysis
Excellent teamwork and leadership skills ability to cooperate well with global stakeholders
Non-Volatile Solutions Memory Group: The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices. The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.